DocumentCode :
781931
Title :
Latent open defect detection using phase-sensitive nonlinearity detection technique
Author :
Halperin, Arnold ; DiStefano, Thomas H. ; Chiang, Shinwu
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume :
18
Issue :
2
fYear :
1995
fDate :
5/1/1995 12:00:00 AM
Firstpage :
358
Lastpage :
365
Abstract :
Alternating and direct electric currents are applied through the metal interconnections in electronic packaging to detect potential electrical opens, such as line narrowings, notches, nicks, cracks, weak connections, and interface contaminations. Due to the nonlinear relationship between the voltage across and current through the metal conductor, distortion signals are generated by the defect region as well as the good conductor. The signal generated from a latent open defect can be detected by comparing the defect signal phase with the reference phase produced by the good conductor. Application of this technique to electronic packaging development and manufacturing can improve product reliability and reduce cost by early detection of latent open defects
Keywords :
integrated circuit packaging; integrated circuit reliability; integrated circuit testing; production testing; cracks; defect region; defect signal phase; distortion signals; electronic packaging; interface contaminations; latent open defect detection; line narrowings; metal interconnections; nicks; notches; phase-sensitive nonlinearity detection technique; potential electrical opens; product reliability; weak connections; Conductors; Contamination; Current; Electric potential; Electronics packaging; Manufacturing; Nonlinear distortion; Phase detection; Signal generators; Voltage;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.386274
Filename :
386274
Link To Document :
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