DocumentCode
782415
Title
Transient Radiation Response Mechanisms in Microelectronics
Author
Bowman, W.C. ; Caldwell, R.S. ; Johnston, A.H. ; Kells, K.E.
Author_Institution
Missile and Information Systems Division the Boeing Company Seattle, Washington
Volume
13
Issue
6
fYear
1966
Firstpage
309
Lastpage
315
Abstract
Previous radiation-effect studies on monolithic microcircuits using p-n junction isolation from the substrate showed that failure under pulsed ionizing irradiation occurred because of radiation-induced currents through the substrate junction.1 It was expected, therefore, that removal of the substrate junction would eliminate this failure mode and lead to a less vulnerable circuit. Since additional construction techniques have become available, a study program was initiated to evaluate the relative radiation resistance of each technique. The goal of this program was to develop an understanding of the radiation response of circuits constructed by means of these various techniques. The following material summarizes the important results of this work, the details of which are reported elsewhere.2 The work Is treated in three subjects: 1. Ionizing Radiation Effects 2. Neutron Radiation Effects 3. Latchup
Keywords
Circuit testing; Current measurement; Ionizing radiation; Logic testing; Microelectronics; Missiles; P-n junctions; Photoconductivity; Pulse circuits; Resistors;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.1996.4324376
Filename
4324376
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