DocumentCode :
783553
Title :
Experience with high-output-resistance MJTC AC-DC transfer standards at high frequencies [multijunction thermal converters]
Author :
Filipski, Piotr S. ; Boecker, Michael
Author_Institution :
Inst. for Nat. Meas. Stand., Nat. Res. Council of Canada, Ottawa, Ont., Canada
Volume :
52
Issue :
4
fYear :
2003
Firstpage :
1314
Lastpage :
1319
Abstract :
The heater-thermopile insulation of planar, thin-film, multijunction thermal converters decreases at high frequencies due to the residual conductivity of the silicon chip. This may cause a change in their intrinsic AC-DC transfer difference, as well as an interaction with the measurement circuit, resulting in increased errors of measurements. This paper discusses the sources of these errors and the methods of their reduction. It is postulated that the AC-DC transfer differences of such converters need to be explicitly defined under specific measurement conditions.
Keywords :
calibration; convertors; electric variables measurement; frequency response; measurement errors; thermopiles; transfer standards; AC-DC transfer differences; MJTC AC-DC transfer standards; calibration; electric variables measurement; heater-thermopile insulation; high-output-resistance MJTC; measurement errors; measurement standards; multijunction thermal converters; nanovoltmeter; planar thin-film thermal converters; silicon chip residual conductivity; transfer standard high frequency response; Councils; Frequency conversion; Insulation; Measurement standards; Semiconductor device measurement; Testing; Thermal conductivity; Thermal variables measurement; Transistors; Voltage;
fLanguage :
English
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9456
Type :
jour
DOI :
10.1109/TIM.2003.816852
Filename :
1232387
Link To Document :
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