DocumentCode :
784441
Title :
Effects of gate recess etching on source resistance
Author :
Cibuzar, Gregory T.
Author_Institution :
Microelectron. Lab., Minnesota Univ., Minneapolis, MN, USA
Volume :
42
Issue :
6
fYear :
1995
fDate :
6/1/1995 12:00:00 AM
Firstpage :
1195
Lastpage :
1196
Abstract :
Recessed gate microwave MESFET´s and MODFET´s have a recessed but unmetallized length Lδ of the channel adjacent to the gate, whose resistance Rδ can significantly contribute to the source resistance Rs. The ratio Rδ/R s can be determined using common test structures
Keywords :
Schottky gate field effect transistors; etching; high electron mobility transistors; microwave field effect transistors; semiconductor device testing; common test structures; gate recess etching; microwave MESFETs; microwave MODFETs; recessed gate FETs; source resistance; unmetallized channel length; Contact resistance; Electrical resistance measurement; Etching; FETs; Implants; MESFETs; Metallization; Ohmic contacts; Surface resistance; Testing;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.387259
Filename :
387259
Link To Document :
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