• DocumentCode
    784502
  • Title

    High-performance single-mode VCSELs in the 1310-nm waveband

  • Author

    Iakovlev, V. ; Suruceanu, G. ; Caliman, A. ; Mereuta, A. ; Mircea, A. ; Berseth, C.-A. ; Syrbu, A. ; Rudra, A. ; Kapon, E.

  • Author_Institution
    BeamExpress S.A., Lausanne, Switzerland
  • Volume
    17
  • Issue
    5
  • fYear
    2005
  • fDate
    5/1/2005 12:00:00 AM
  • Firstpage
    947
  • Lastpage
    949
  • Abstract
    High-performance vertical-cavity surface-emitting lasers (VCSELs) emitting in the 1310-nm waveband are fabricated by bonding AlGaAs-GaAs distributed Bragg reflectors on both sides of a InP-based cavity. A 2-in wafer bonding process is optimized to produce very good on-wafer device parameter uniformity. Carrier injection is implemented via double intracavity contact layers and a tunnel junction. A 1.2-mW single-mode output power is obtained in the temperature range of 20°C-80°C. Modulation capability at 3.2 Gb/s is demonstrated up to 70°C. Overall VCSEL performance complies with the requirements of the 10 GBASE-LX4 IEEE.802.3ae standard, which opens the way for novel applications of VCSELs emitting in the 1310-nm band.
  • Keywords
    III-V semiconductors; aluminium compounds; distributed Bragg reflector lasers; gallium arsenide; indium compounds; laser cavity resonators; laser modes; optical fibre communication; optical modulation; semiconductor lasers; surface emitting lasers; wafer bonding; 1.2 mW; 1310 nm; 2 in; 20 to 80 degC; 3.2 Gbit/s; AlGaAs-GaAs distributed Bragg reflectors; AlGaAs-GaAs-InP; InP-based cavity; Wafer bonding; carrier injection; double intracavity contact layers; high-performance VCSEL; laser fabrication; on-wafer device parameter; optical modulation; single-mode VCSEL; tunnel junction; vertical cavity surface-emitting lasers; Distributed Bragg reflectors; Etching; Mirrors; Power generation; Surface emitting lasers; Surface waves; Temperature distribution; Vertical cavity surface emitting lasers; Voltage; Wafer bonding; Surface-emitting lasers; wafer bonding;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2005.845654
  • Filename
    1424062