DocumentCode
784874
Title
Properties of high strength Cu-Nb conductor for pulsed magnet applications
Author
Han, Ke ; Toplosky, Vince J. ; Walsh, Robert ; Swenson, Chuck ; Lesch, Benny ; Pantsyrnyi, V.I.
Author_Institution
Nat. High Magnetic Field Lab., Florida State Univ., Tallahassee, FL, USA
Volume
12
Issue
1
fYear
2002
fDate
3/1/2002 12:00:00 AM
Firstpage
1176
Lastpage
1180
Abstract
Various tests have been undertaken to study the effects of annealing, testing temperatures and volume fraction of the Cu cladding on the properties of Cu-Nb conductors being developed for pulsed magnet applications. The results demonstrate that short time annealing used for insulation had no significant effect on the tensile property of Cu-Nb conductors. The cryogenic temperatures are beneficial to both the conductivity and mechanical properties of the conductors, especially the tensile strength of the Cu cladding. The wire-drawing fabrications showed that wires of 4 mm×6 mm cross-section-area with a significant volume fraction of Cu cladding could be obtained, leading to final tensile strengths of up to 1100 MPa at room temperature. The strength is increased by about 20% at 77 K. The 77 K-conductivity is about 4.5 times of the room temperature one. The strengthening mechanisms and resistivity variation of the Cu-Nb composite are discussed and it is argued that the distance between the Nb ribbons plays an important role in the variation of these properties.
Keywords
annealing; conductors (electric); copper alloys; internal stresses; mechanical strength; niobium alloys; superconducting cables; superconducting magnets; 1100 MPa; 77 K; Cu cladding; Cu-Nb; Cu-Nb composite; Cu-Nb conductors; Nb ribbons; annealing; cryogenic temperatures; internal stresses; mechanical properties; room temperature; tensile strength; up to 1100 MPa; wire-drawing fabrications; Annealing; Conductivity; Conductors; Cryogenics; Fabrication; Insulation; Magnetic properties; Mechanical factors; Temperature; Testing;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2002.1018611
Filename
1018611
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