DocumentCode :
784966
Title :
ESD-Protected Wideband CMOS LNAs Using Modified Resistive Feedback Techniques With Chip-on-Board Packaging
Author :
Chang, Tienyu ; Chen, Jinghong ; Rigge, Lawrence A. ; Lin, Jenshan
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL
Volume :
56
Issue :
8
fYear :
2008
Firstpage :
1817
Lastpage :
1826
Abstract :
A novel modified resistive feedback structure for designing wideband low-noise amplifiers (LNAs) is proposed and demonstrated in this paper. Techniques including feedback through a source follower, an R-C feedback network, a gate peaking inductor inside the feedback loop, and neutralization capacitors are used. Bond-wire inductors and electrostatic devices (ESDs) are co-designed to improve the chip performance. Two LNAs, LNA1 and LNA2, were fabricated using a TSMC digital 90-nm CMOS technology. Both chips were tested on board using chip-on-board packages with ESD diodes added at the inputs and outputs. LNA1 achieves a 3-dB bandwidth of 9 GHz with 10 dB of power gain and a minimum noise figure (NF) of 4.2 dB. LNA2 achieves a 3-dB bandwidth of 3.2 GHz with 15.5 dB of power gain and a minimum NF of 1.76 dB. The two LNAs have third-order intermodulation intercept points of 8 and 9 dBm. Their power consumptions are 20 and 25 mW with a 1.2-V supply, respectively.
Keywords :
CMOS integrated circuits; chip-on-board packaging; electrostatic devices; low noise amplifiers; ultra wideband technology; ESD-protected wideband CMOS LNA; bond-wire inductors; chip-on-board packaging; electrostatic devices; modified resistive feedback techniques; multiband receivers; third-order intermodulation intercept points; wideband low-noise amplifiers; CMOS; electrostatic devices (ESDs); low-noise amplifier (LNA); multiband receiver; resistive feedback; ultra-wideband (UWB);
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2008.927301
Filename :
4560051
Link To Document :
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