• DocumentCode
    785791
  • Title

    Throughput-driven floorplanning with wire pipelining

  • Author

    Casu, Mario R. ; Macchiarulo, Luca

  • Volume
    24
  • Issue
    5
  • fYear
    2005
  • fDate
    5/1/2005 12:00:00 AM
  • Firstpage
    663
  • Lastpage
    675
  • Abstract
    The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires.
  • Keywords
    flip-flops; integrated circuit interconnections; integrated circuit layout; network routing; simulated annealing; system-on-chip; wiring; SoC; cost function; flip-flops; long interconnects; simple router; simulated annealing; systems-on-chip; throughput-driven floorplanning; wire pipelining; Clocks; Cost function; Flip-flops; Frequency; Joining processes; Logic; Pins; Pipeline processing; Throughput; Wire; Floorplanning; systems-on-chip (SoC); throughput; wire pipelining;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2005.846371
  • Filename
    1424170