Ultra-low-power design

Author

Rabaey, J. ; Ammer, J. ; Otis, B. ; Burghardt, F. ; Chee, Y.H. ; Pletcher, N. ; Sheets, M. ; Qin, H.

Volume

22

Issue

4

fYear

2006

Firstpage

23

Lastpage

29

Abstract

In this article, we describe how such an integrated approach has indeed made it possible to produce a PicoNode that meets the original goals. The resulting node combines innovative technologies, such as radio-frequency microelectromechanical systems (RF-MEMS) with ultra-low-power RF and digital integrated circuit (IC) design, and employs aggressive energy-scavenging and packaging techniques. For these technological advances to come to their full fruition, they must be complemented by novel opportunistic networking and wireless protocol schemes that virtually eliminate standby power while still providing robustness

Keywords

integrated circuit design; low-power electronics; radiofrequency integrated circuits; wireless sensor networks; PicoNode project; RF integrated circuit design; RF-MEMS; ambient intelligence; digital integrated circuit design; energy-scavenging; packaging techniques; ultra low power design; wireless sensor networks; Batteries; Capacitors; Ceramics; Coupling circuits; Energy storage; Packaging; Photovoltaic cells; Prototypes; Transistors; Voltage;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/MCD.2006.1708372

Filename

1708372