DocumentCode
786101
Title
Design considerations for a-Si:H/SiGe/Si heterojunction bipolar transistors
Author
Della Corte, Francesco G. ; Pezzimenti, Fortunato
Author_Institution
Fac. of Eng., Mediterranea Univ. of Reggio Calabria, Naples, Italy
Volume
50
Issue
10
fYear
2003
Firstpage
2180
Lastpage
2182
Abstract
A SiGe/Si heterojunction bipolar transistor (HBT) with a thin n+ hydrogenated amorphous silicon (a-Si:H) emitter is discussed, in particular with reference to the dc current gain, by means of numerical simulations. The role of the fundamental geometric design parameters on the device performance is analyzed for a set of devices withstanding the same maximum emitter-collector voltage. It is shown that the emitter thickness has a minor effect on the device current gain, which is instead strongly influenced by the base thickness. However, due to the poor carrier mobility typical of a-Si:H, the total current handled by the device strongly depends on the emitter thickness and resistance. A dc current gain close to 10000 can be predicted for optimized a-Si:H/SiGe HBTs with a thin emitter and a narrow highly doped base.
Keywords
Ge-Si alloys; amorphous semiconductors; carrier mobility; elemental semiconductors; heterojunction bipolar transistors; semiconductor device models; semiconductor materials; Si:H-SiGe-Si; Si:H/SiGe/Si; base thickness; carrier mobility; dc current gain; device current gain; emitter thickness; geometric design parameters; heterojunction bipolar transistors; maximum emitter-collector voltage; numerical simulations; resistance; Amorphous silicon; Crystallization; Germanium silicon alloys; Heterojunction bipolar transistors; Numerical simulation; Performance analysis; Performance gain; Plasma temperature; Silicon germanium; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2003.816104
Filename
1232941
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