DocumentCode :
786118
Title :
Parylene gas chromatographic column for rapid thermal cycling
Author :
Noh, Hong-Seok ; Hesketh, Peter J. ; Frye-Mason, Gregory C.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
11
Issue :
6
fYear :
2002
fDate :
12/1/2002 12:00:00 AM
Firstpage :
718
Lastpage :
725
Abstract :
This paper presents a parylene gas chromatographic column with an embedded heating element. The parylene coating on a silicon microchannel and parylene/parylene thermal bonding technique were employed to fabricate a parylene column. The heating element is a thin gold film evaporated on the corrugated surface of the parylene column having long and rectangular geometry. Joule heating via the thin gold film is a very effective heating system for a parylene column. ANSYS heat transfer analysis was performed to investigate the thermal cycling and temperature uniformity of the parylene column. The parylene column showed much faster heating and cooling rates as well as lower power consumption compared to a silicon/glass column. The temperature difference between the top and the bottom of a parylene column that is due to the low thermal conductivity of parylene could be reduced to less than 0.1 K by inserting a thin metal layer between two parylene layers, forming a triple layer structure (parylene/platinum/parylene).
Keywords :
chromatography; finite element analysis; heating elements; micromachining; polymers; temperature distribution; ANSYS heat transfer analysis; Au; Joule heating; Pt; Si; corrugated surface; embedded heating element; evaporated gold thin film; finite element method; metal layer; microfabrication technology; parylene coating; parylene gas chromatographic column; parylene/parylene thermal bonding; power consumption; rapid thermal cycling; silicon microchannel; temperature distibution; thermal conductivity; Bonding; Coatings; Corrugated surfaces; Geometry; Gold; Heating; Microchannel; Silicon; Temperature; Thermal conductivity;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2002.805052
Filename :
1097792
Link To Document :
بازگشت