DocumentCode
786884
Title
Activation energy of thin SiO2 films
Author
Ditali, A. ; Black, William
Author_Institution
Micron Semiconductor Inc., Boise, ID, USA
Volume
28
Issue
21
fYear
1992
Firstpage
2014
Lastpage
2016
Abstract
The activation energy of thin SiO2 films was evaluated at varying temperatures, applied electric fields, oxide thicknesses and electrode areas. It was shown that the thermal activation energy is not constant and is dependent on various parameters that have an impact on the breakdown rate of reaction.
Keywords
MOS integrated circuits; dielectric thin films; electric breakdown of solids; insulated gate field effect transistors; metal-insulator-semiconductor structures; oxidation; reliability; silicon compounds; activation energy; breakdown rate of reaction; electric fields; electrode areas; oxide thicknesses; temperatures; thin SiO 2 films;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19921291
Filename
170895
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