A microfabricated floating-element shear stress sensor using wafer-bonding technology

Author

Shajii, Javad ; Ng, Kay-Yip ; Schmidt, Martin A.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

Volume

1

Issue

2

fYear

1992

fDate

6/1/1992 12:00:00 AM

Firstpage

89

Lastpage

94

Abstract

A microfabricated floating-element (120 μm×140 μm×5 μm) liquid shear stress sensor has been developed using wafer-bonding technology. The sensor has been designed for high shear stresses (1-100 kPa) and high-pressure environments (up to 6600 psi) and utilizes a piezoresistive transduction scheme. Analytical and finite-element method (FEM) modeling have been performed to predict the sensor response. The sensor has been tested for both its mechanical integrity in high-pressure environments and its output response in the controlled environment of a cone and plate viscometer. The processing steps in the fabrication of the sensor, the analytical and FEM modeling, the experimental procedures, and the results of the experiments are described

Keywords

electric sensing devices; finite element analysis; micromechanical devices; stress measurement; viscometers; 140 to 5 micron; 6600 psi; cone and plate viscometer; experimental procedures; fabrication; finite-element method; high shear stresses; high-pressure environments; liquid shear stress sensor; mechanical integrity; microfabricated floating-element; output response; piezoresistive transduction scheme; sensor response; wafer-bonding technology; Fabrication; Finite element methods; Mechanical sensors; Performance analysis; Piezoresistance; Predictive models; Semiconductor device modeling; Sensor phenomena and characterization; Stress; Testing;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/84.157363

Filename

157363