DocumentCode
787476
Title
Determining the location of localized defect in the perpendicular junction configuration with the use of electron beam induced current
Author
Phua, Poh Chin ; Ong, Vincent K.S.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Volume
49
Issue
11
fYear
2002
fDate
11/1/2002 12:00:00 AM
Firstpage
2036
Lastpage
2046
Abstract
This paper describes a new method of determining the location of a localized defect in semiconductor materials using the perpendicular p-n junction configuration. The scanning electron microscope (SEM) operating in the charge-collection, or the electron beam induced current (EBIC) mode, is used for this. This method is based on the model used to calculate the contrast of a localized defect as suggested by C. Donolato and is known as the contrast Cn´´ model. This model can be used to precisely extract the location of the localized defect and is unaffected by the value of the surface recombination velocity at the beam entrance surface. The model of the localized defect used in this paper is characterized by minority carriers with constant lifetimes that are lower than those in the bulk. An electron beam with an extended generation profile was used in a two-dimensional (2-D) device simulator, for the verification of the theory.
Keywords
EBIC; carrier lifetime; defect states; minority carriers; p-n junctions; scanning electron microscopy; 2D device simulator; EBIC; SEM; carrier lifetime; charge-collection mode; contrast Cn´´ model; localized defect; minority carriers; perpendicular p-n junction; semiconductor materials; surface recombination velocity; Curve fitting; Electron beams; Electron microscopy; P-n junctions; Radiative recombination; Scanning electron microscopy; Semiconductor materials; Spontaneous emission; Surface fitting; Two dimensional displays;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2002.804703
Filename
1097923
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