Title :
Impact of the trapping of anode hot holes on silicon dioxide breakdown
Author :
Vogel, Eric M. ; Heh, Da-Wei ; Bernstein, Joseph B. ; Suehle, John S.
Author_Institution :
Div. of Semicond. Electron., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Abstract :
Hot holes are injected from the anode and trapped in thin silicon dioxide using constant voltage stress at large gate voltage. By comparing oxides having trapped holes with oxides in which the holes were detrapped, it is shown that the presence of trapped holes does not affect the breakdown of the oxide. Furthermore, as the temperature during stress is increased, less hole trapping is observed whereas the charge-to-breakdown of the oxide is decreased. The results show that although the trapping of hot holes injected using anode hole injection (AHI) may be partly responsible for defect generation in silicon dioxide, breakdown cannot be limited by the number of holes trapped in the oxide.
Keywords :
MOS capacitors; MOSFET; dielectric thin films; hole traps; hot carriers; semiconductor device breakdown; semiconductor device reliability; silicon compounds; CMOS devices; SiO/sub 2/-Si; TDDB; anode hole injection; anode hot holes; charge-to-breakdown; constant voltage stress; defect generation; hole trapping; hot hole injection; oxide. breakdown; reliability; thin oxide breakdown; time-dependent dielectric breakdown; trapped holes; Anodes; Breakdown voltage; Dielectric breakdown; Electric breakdown; Electron traps; Hot carriers; Hydrogen; NIST; Silicon compounds; Stress;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2002.805004