• DocumentCode
    787831
  • Title

    Strained epilayers effectively reduce plasma-induced fluorine damage in P-HEMTs

  • Author

    Uchiyama, Hiroyuki ; Taniguchi, Takafumi ; Kudo, Makoto

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Tokyo, Japan
  • Volume
    5
  • Issue
    4
  • fYear
    2005
  • Firstpage
    706
  • Lastpage
    712
  • Abstract
    We intentionally inserted several strained epilayers, namely In0.5Ga0.5As, InAs, and InSb, as fluorine-trapping barriers in a conventional pseudomorphic high electron mobility transistor (P-HEMT) structure and investigated their effectiveness against plasma-induced fluorine damage using Hall measurements and secondary ion mass spectrometry (SIMS) analysis. The strained barriers effectively diminished plasma-induced fluorine incorporation into deeper layers than the δ-doped layer and improved the carrier density and electron mobility compared with those of the conventional P-HEMT. In particular, when the most strained InSb barrier was inserted into the P-HEMT using post-thermal annealing, the carrier density and electron mobility remarkably recovered to 85% and 97% of their respective values before processing because of diminished fluorine incorporation and reduction of incorporated fluorine from the channel layer to the upper layers. This confirms that highly strained barriers are very effective at suppressing plasma-induced fluorine damage in P-HEMTs.
  • Keywords
    III-V semiconductors; annealing; carrier density; electron mobility; fluorine; gallium arsenide; high electron mobility transistors; indium compounds; secondary ion mass spectroscopy; semiconductor device reliability; Hall measurement; In0.5Ga0.5As; InAs; InSb; P-HEMT structure; carrier density; dry etching; fluorine-trapping barriers; plasma-induced fluorine damage reduction; post-thermal annealing; pseudomorphic high electron mobility transistor; secondary ion mass spectrometry; strained epilayers; Annealing; Charge carrier density; Electron mobility; HEMTs; MODFETs; Mass spectroscopy; PHEMTs; Plasma density; Plasma materials processing; Plasma measurements; Damage; dry etching; fluorine;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2005.857874
  • Filename
    1573688