DocumentCode
787939
Title
Efficient analysis of microwave passive structures using 3-D envelope-finite element (EVFE)
Author
Tsai, Hsiao-Ping ; Wang, Yuanxun ; Itoh, Tatsuo
Author_Institution
Mindspeed Technol., Newport Beach, CA, USA
Volume
50
Issue
12
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
2721
Lastpage
2727
Abstract
A three-dimensional envelope-finite element (EVFE) technique is proposed to solve the transient responses of general microwave passive structures. EVFE simulates the signal envelope rather than the original signal waveform by de-embedding the carrier from the time-domain wave equation. The sampling rate of the time-domain waveform is only governed by the Nyquist rate of the envelope, rather than that of the carrier in traditional time-domain simulators. Compared to traditional finite-element time-domain (FETD) methods, the computational cost can be dramatically reduced when the signal envelope-to-carrier ratio is very small. It also provides much higher computational efficiency than frequency-domain finite-element methods for simulating frequency responses over certain bandwidth. This technique is applied to solve a waveguide structure with a dielectric post discontinuity and a microstrip patch antenna. The accuracy and efficiency is demonstrated and compared with traditional unconditionally stable FETD methods.
Keywords
antenna theory; finite element analysis; microstrip antennas; time-domain analysis; waveguide discontinuities; waveguide theory; computational efficiency; dielectric post discontinuity; frequency response; microstrip patch antenna; microwave passive structure; three-dimensional envelope finite element method; time-domain simulation; transient response; waveguide structure; Bandwidth; Computational efficiency; Computational modeling; Finite element methods; Frequency; Microwave theory and techniques; Partial differential equations; Sampling methods; Time domain analysis; Waveguide discontinuities;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2002.805190
Filename
1097989
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