A TLM-SPICE interconnection framework for coupled field and circuit analysis in the time domain

Author

So, Poman P M ; Hoefer, Wolfgang J R

Author_Institution

Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada

Volume

50

Issue

12

fYear

2002

fDate

12/1/2002 12:00:00 AM

Firstpage

2728

Lastpage

2733

Abstract

A general SPICE-transmission-line matrix (TLM) interconnection framework has been developed. The connection algorithm is based on the representation of the TLM network by equivalent Thevenin and/or Norton sources. Fundamental issues such as source equivalence and SPICE-TLM interconnection options have been examined. The framework opens new and far-reaching possibilities for hybrid global microwave and high-speed digital circuit modeling in the time domain because it combines the extensive circuit and device models of SPICE with general three-dimensional field solutions.

Keywords

SPICE; time-domain analysis; transmission line matrix methods; TLM-SPICE interconnection algorithm; coupled field-circuit analysis; equivalent Norton source; equivalent Thevenin source; high-speed digital circuit model; hybrid global microwave model; three-dimensional electromagnetic field; time domain analysis; Circuit analysis; Coupling circuits; Digital circuits; Integrated circuit interconnections; RLC circuits; SPICE; Time domain analysis; Transmission line matrix methods; Transmission lines; Voltage;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2002.805199

Filename

1097990