DocumentCode :
78801
Title :
Charge Quantity Influence on Resistance Switching Characteristic During Forming Process
Author :
Chu, Tian-Jian ; Chang, Ting-Chang ; Tsai, Tsung-Ming ; Wu, Hung-Hsien ; Chen, Jau-Horng ; Chang, Kuo-Chu ; Young, Tai-Fa ; Chen, Ke-Horng ; Syu, Yong-En ; Chang, Geng-Wei ; Chang, Yi-Feng ; Chen, M.-C. ; Lou, Jyun-Hao ; Pan, Jhih-Hong ; Chen, Jen-Yin ; T
Author_Institution :
Department of Materials and Optoelectronic Science, National Sun Yat-Sen University, Kaohsiung, Taiwan
Volume :
34
Issue :
4
fYear :
2013
fDate :
Apr-13
Firstpage :
502
Lastpage :
504
Abstract :
In this letter, we presented that the charge quantity is the critical factor for forming process. Forming is a pivotal process in resistance random access memory to activate the resistance switching behavior. However, overforming would lead to device damage. In general, the overshoot current has been considered as a degradation reason during the forming process. In this letter, the quantity of charge through the switching layer has been proven as the key element in the formation of the conduction path. Ultrafast pulse forming can form a discontinuous conduction path to reduce the operation power.
Keywords :
Educational institutions; Electrodes; Hafnium compounds; Resistance; Silicon; Switches; Tin; Forming process; hafnium oxide $( hbox{HfO}_{2})$; nonvolatile memory; resistance switching;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2013.2242843
Filename :
6473822
Link To Document :
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