DocumentCode :
788012
Title :
Low-frequency noise measurements as an investigation tool of pixel flickering in cooled Hg0.7Cd0.3Te focal plane arrays
Author :
Perez, Jean-Philippe ; Myara, Mikhael ; Alabedra, Robert ; Orsal, Bernard ; Leyris, Cédric ; Tourrenc, Jean-Philippe ; Signoret, Philippe
Author_Institution :
Centre d Electronique et de MicroOptoElectronique de Montpellier, Montpellier Univ., France
Volume :
52
Issue :
5
fYear :
2005
fDate :
5/1/2005 12:00:00 AM
Firstpage :
928
Lastpage :
933
Abstract :
We report on electrical noise measurements on both Hg0.7Cd0.3Te test patterns and hybrid 320 × 256 focal plane array in order to explain the low-frequency pixel flickering physical origin. Dark and under infrared illumination test patterns characterization highlights that the detector chip is not responsible for the flickering phenomenon. Taking into account the silicon readout chip influence when the full infrared complementary metal-oxyd semiconductor (IRCMOS) infrared detector is investigated, the indium bump based interconnecting system is finally pointed out as a potential excess noise source.
Keywords :
CMOS image sensors; electric noise measurement; flicker noise; focal planes; infrared detectors; 1/f noise; Hg0.7Cd0.3Te; IRCMOS infrared detector; RTS; cooled focal plane arrays; detector chip; electrical noise measurements; excess noise source; illumination test patterns characterization; indium bump; infrared photodetector; interconnecting system; pixel flickering; silicon readout chip; 1f noise; Indium; Infrared detectors; Lighting; Low-frequency noise; Mercury (metals); Noise measurement; Silicon; Tellurium; Testing; Detectivity; HgCdTe; RTS; indium bump; infrared complementary metal-oxyd semiconductor (IRCMOS); infrared photodetector; pixel;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2005.846328
Filename :
1424381
Link To Document :
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