DocumentCode :
788182
Title :
Novel surface structure and its fabrication process for MEMS fingerprint sensor
Author :
Sato, Norio ; Shigematsu, Satoshi ; Morimura, Hiroki ; Yano, Masaki ; Kudou, Kazuhisa ; Kamei, Toshikazu ; Machida, Katsuyuki
Author_Institution :
NTT Mircosystem Integration Labs., NTT Corp., Kanagawa, Japan
Volume :
52
Issue :
5
fYear :
2005
fDate :
5/1/2005 12:00:00 AM
Firstpage :
1026
Lastpage :
1032
Abstract :
This paper describes a microelectromechanical systems (MEMS) fingerprint sensor that has novel protrusions on the sensor surface in order to detect clear fingerprint images for various finger surface conditions. A preliminary experiment clarified the importance of contact between soft finger ridges and the sensor surface in producing fingerprint images. Based on this, novel T-shaped protrusions on the sensor surface are proposed as an interface to mediate the contact. In order to fabricate the overhung form of the T-shaped structure, photosensitive polyimide and a copper sacrificial layer were used. Using the CMOS-compatible MEMS fabrication process, the arrayed T-shaped protrusions of polyimide are stacked on a CMOS large-scale integrated circuit. The sensor produced clear fingerprint images for various kinds of fingers. Measurement of the relationship between applied force and sensor output showed that the T-shaped protrusions achieved high sensitivity regardless of finger elasticity. Reliability tests confirmed that the sensor with the T-shaped protrusions has sufficient mechanical and electrical strength for wide applications.
Keywords :
CMOS image sensors; fingerprint identification; micromechanical devices; reliability; surface structure; CMOS integrated circuit; MEMS fabrication; MEMS fingerprint sensor; T-shaped protrusions; copper sacrificial layer; fabrication process; finger elasticity; fingerprint images; photosensitive polyimide; reliability tests; sensor surface; surface structure; Fabrication; Fingerprint recognition; Fingers; Image matching; Image sensors; Mechanical sensors; Micromechanical devices; Sensor phenomena and characterization; Sensor systems; Surface structures; CMOS large-scale integrated circuit (LSI); elasticity; fingerprint sensor; microelectromechanical systems (MEMS); sensitivity;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2005.846342
Filename :
1424395
Link To Document :
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