• DocumentCode
    788182
  • Title

    Novel surface structure and its fabrication process for MEMS fingerprint sensor

  • Author

    Sato, Norio ; Shigematsu, Satoshi ; Morimura, Hiroki ; Yano, Masaki ; Kudou, Kazuhisa ; Kamei, Toshikazu ; Machida, Katsuyuki

  • Author_Institution
    NTT Mircosystem Integration Labs., NTT Corp., Kanagawa, Japan
  • Volume
    52
  • Issue
    5
  • fYear
    2005
  • fDate
    5/1/2005 12:00:00 AM
  • Firstpage
    1026
  • Lastpage
    1032
  • Abstract
    This paper describes a microelectromechanical systems (MEMS) fingerprint sensor that has novel protrusions on the sensor surface in order to detect clear fingerprint images for various finger surface conditions. A preliminary experiment clarified the importance of contact between soft finger ridges and the sensor surface in producing fingerprint images. Based on this, novel T-shaped protrusions on the sensor surface are proposed as an interface to mediate the contact. In order to fabricate the overhung form of the T-shaped structure, photosensitive polyimide and a copper sacrificial layer were used. Using the CMOS-compatible MEMS fabrication process, the arrayed T-shaped protrusions of polyimide are stacked on a CMOS large-scale integrated circuit. The sensor produced clear fingerprint images for various kinds of fingers. Measurement of the relationship between applied force and sensor output showed that the T-shaped protrusions achieved high sensitivity regardless of finger elasticity. Reliability tests confirmed that the sensor with the T-shaped protrusions has sufficient mechanical and electrical strength for wide applications.
  • Keywords
    CMOS image sensors; fingerprint identification; micromechanical devices; reliability; surface structure; CMOS integrated circuit; MEMS fabrication; MEMS fingerprint sensor; T-shaped protrusions; copper sacrificial layer; fabrication process; finger elasticity; fingerprint images; photosensitive polyimide; reliability tests; sensor surface; surface structure; Fabrication; Fingerprint recognition; Fingers; Image matching; Image sensors; Mechanical sensors; Micromechanical devices; Sensor phenomena and characterization; Sensor systems; Surface structures; CMOS large-scale integrated circuit (LSI); elasticity; fingerprint sensor; microelectromechanical systems (MEMS); sensitivity;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2005.846342
  • Filename
    1424395