• DocumentCode
    789141
  • Title

    Effects of elevated temperature treatments in microstructure release procedures

  • Author

    Abe, Takeshi ; Messner, William C. ; Reed, Michael L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    4
  • Issue
    2
  • fYear
    1995
  • fDate
    6/1/1995 12:00:00 AM
  • Firstpage
    66
  • Lastpage
    75
  • Abstract
    Elevated temperature solvent rinses are shown to reduce stiction of micromechanical structures after release etch processing. Rinsing the structures in boiling methanol after rinsing in water significantly improves yields. Photographs taken during the drying process indicate two distinct modes of solvent vaporization, one of which leads to stiction. This process can be modeled and used to predict the critical length of cantilevered beams above which stiction occurs. A key element of this model is that the dynamics of the drying process are strongly influenced by the shape of the microstructure perimeter. The decrease in stiction cannot be explained solely by liquid bridging modeling in case of elevated rinse temperature. Stiction can be further decreased by drying at high temperature in a rapid thermal annealer; this suggests that instability of the trapped liquid under tension at elevated temperatures may be a dominant factor in reducing the stiction
  • Keywords
    circuit optimisation; drying; etching; integrated circuit yield; micromechanical devices; rapid thermal annealing; boiling methanol; cantilevered beams; critical length; drying process; elevated temperature treatments; liquid bridging modeling; micromechanical structures; microstructure perimeter; microstructure release procedures; rapid thermal annealer; release etch processing; solvent rinses; solvent vaporization; stiction; trapped liquid instability; yields; Etching; Methanol; Micromechanical devices; Microstructure; Predictive models; Rapid thermal processing; Shape; Solvents; Structural beams; Temperature;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.388114
  • Filename
    388114