DocumentCode
789141
Title
Effects of elevated temperature treatments in microstructure release procedures
Author
Abe, Takeshi ; Messner, William C. ; Reed, Michael L.
Author_Institution
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Volume
4
Issue
2
fYear
1995
fDate
6/1/1995 12:00:00 AM
Firstpage
66
Lastpage
75
Abstract
Elevated temperature solvent rinses are shown to reduce stiction of micromechanical structures after release etch processing. Rinsing the structures in boiling methanol after rinsing in water significantly improves yields. Photographs taken during the drying process indicate two distinct modes of solvent vaporization, one of which leads to stiction. This process can be modeled and used to predict the critical length of cantilevered beams above which stiction occurs. A key element of this model is that the dynamics of the drying process are strongly influenced by the shape of the microstructure perimeter. The decrease in stiction cannot be explained solely by liquid bridging modeling in case of elevated rinse temperature. Stiction can be further decreased by drying at high temperature in a rapid thermal annealer; this suggests that instability of the trapped liquid under tension at elevated temperatures may be a dominant factor in reducing the stiction
Keywords
circuit optimisation; drying; etching; integrated circuit yield; micromechanical devices; rapid thermal annealing; boiling methanol; cantilevered beams; critical length; drying process; elevated temperature treatments; liquid bridging modeling; micromechanical structures; microstructure perimeter; microstructure release procedures; rapid thermal annealer; release etch processing; solvent rinses; solvent vaporization; stiction; trapped liquid instability; yields; Etching; Methanol; Micromechanical devices; Microstructure; Predictive models; Rapid thermal processing; Shape; Solvents; Structural beams; Temperature;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/84.388114
Filename
388114
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