Title :
Mechanical behaviors of 60/40 tin-lead solder lap joints
Author :
Enke, Neal F. ; Kilinski, Thomas J. ; Schroeder, Scott A. ; Lesniak, Jon R.
Author_Institution :
Dept. of Eng. Mech., Wisconsin Univ., Madison, WI, USA
fDate :
12/1/1989 12:00:00 AM
Abstract :
The authors present monotonic, fatigue, and creep-fatigue data for 60/40 tin-lead solder lap joints at room temperature. Monotonic tests performed include rapid-strain shear, creep, and stress relaxation tests. Fundamental data are presented for the strain range partitioning (SRP) approach to creep-fatigue life prediction. SRP is found to model the solder creep-fatigue response adequately for the range of frequencies (0.007 to 0.5 Hz) and waveshapes tested. The elastic modulus and Poisson´s ratio were determined to be 38.6 GPa and 0.36, respectively. Thorough experimental and numerical analyses of a sample 60/40 tin-lead solder lap joint revealed a complex strain state along the solder-copper interface. Fatigue lives for 0.5-Hz tests performed under load control correlate with the lives to 50% load drop for tests performed under strain control
Keywords :
creep testing; fatigue testing; lead alloys; life testing; materials testing; printed circuit manufacture; reliability; soldering; surface mount technology; tin alloys; 0.007 to 0.5 Hz; 50% load drop; Poisson´s ratio; SMT solder joints; SnPb solder lap joints; SnPb-Cu; complex strain state; creep-fatigue data; creep-fatigue life prediction; elastic modulus; fatigue data; long term reliability; monotonic tests; rapid-strain shear; room temperature; stress relaxation tests; waveshapes; Capacitive sensors; Creep; Fatigue; Frequency; Load flow control; Numerical analysis; Performance evaluation; Stress; Temperature; Testing;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
