Title :
Electrooptic planar deflector switches with thin-film PLZT active elements
Author :
Glebov, Alexei L. ; Lee, Michael G. ; Huang, Lidu ; Aoki, Shigenori ; Yokouchi, Kishio ; Ishii, Masatoshi ; Kato, Masayuki
Author_Institution :
Fujitsu Labs. of America Inc., Sunnyvale, CA, USA
Abstract :
First prototypes of electrooptic (EO) planar deflector switches (PDSs) are fabricated with hybrid integration on Si substrates. Planar optical modules, made in silica-on-silicon technology, consist of input and output (I/O) waveguide microlenses facing each other and slab waveguides in between. The modules interconnect the I/O fibers with laterally collimated light beams less than 400 μm in width at distances up to 100 mm with losses lower than 3 dB. Thin lead lanthanum zirconium titanate (PLZT) films with prism-shaped electrodes grown on SrTiO3 substrates form the deflector elements. The PLZT films are more than 10 μm thick with EO coefficients about 40 pm/V. The deflector assembly technology provides chip vertical positioning accuracy better than 1 μm. The deflector chips are attached to the optical substrates with thermo-compression flip-chip bonding. The optical power losses of the modules with test silica chips can be as low as 3.6 dB. However, the lowest module losses achieved with PLZT are about 10 dB. The channel-to-channel switching operations are demonstrated at about 40 V and switching times less than 500 ns.
Keywords :
assembling; electro-optical switches; electrodes; ferroelectric thin films; flip-chip devices; integrated optics; integrated optoelectronics; lanthanum compounds; lead compounds; microlenses; optical communication equipment; optical deflectors; optical fabrication; optical interconnections; optical waveguides; silicon; silicon compounds; 10 dB; 100 mm; 3.6 dB; 40 V; 400 mum; I/O fibers; PLZT films; PbLaZrO3TiO3; Si; Si substrates; SiO2-Si; SrTiO3; SrTiO3 substrates; channel-to-channel switching; chip vertical positioning accuracy; deflector assembly; deflector chips; electrooptic switches; ferroelectric films; flip-chip bonding; hybrid integration; input waveguide microlenses; laterally collimated light beams; module losses; optical interconnects; optical power losses; optical substrates; output waveguide microlenses; planar deflector switches; planar optical modules; prism-shaped electrodes; silica-on-silicon technology; slab waveguides; test silica chips; thermocompression bonding; thin-film active elements; Electrooptic deflectors; Electrooptical waveguides; Optical films; Optical losses; Optical planar waveguides; Optical switches; Optical waveguides; Planar waveguides; Substrates; Transistors; Ferroelectric films; optical planar waveguides; optical switches; optoelectronic integrated circuits; photonic devices;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2005.846515