DocumentCode
791675
Title
Toward two-dimensional self-organization of nanostructures using wafer bonding and nanopatterned silicon surfaces
Author
Buttard, Denis ; Eymery, Joel ; Fournel, Frank ; Gentile, Pascal ; Leroy, Fabien ; Magnea, Noel ; Moriceau, Hubert ; Renaud, Gilles ; Rieutord, Francois ; Rousseau, Karine ; Rouviere, Jean-Luc
Author_Institution
Dept. de Recherche Fondamentale sur la Matiere Condensee, CEA, Centre d´´Etudes de Grenoble, France
Volume
38
Issue
8
fYear
2002
fDate
8/1/2002 12:00:00 AM
Firstpage
995
Lastpage
1005
Abstract
The structure of ultrathin silicon layers obtained by molecular hydrophobic bonding is investigated. The twist and tilt angles between the two crystals are accurately controlled. The buried Si|Si interface is observed by transmission electron microscopy and by grazing incidence X-ray techniques. For low twist angle values (ψ<5°) plane view observations reveal well-defined dislocation networks. Cross-section observations give evidence that the dislocation networks are localized at the bonding interfacial plane with no threading dislocation. Grazing incidence small angle X-ray scattering measurements confirm the good quality of the bonding interface as well as the quality of the dislocation networks. Grazing incidence X-ray diffraction is also used and shows the long-range order of the periodic strain field in the silicon layer. It shows, especially, the interaction between the dislocations. X-ray reflectivity was employed and estimated that the interfacial thickness (i.e., thickness of the bonding) lower than 1 nm decreases when the twist angle increases. The nanopatterned surface is then investigated by scanning tunneling microscopy and X-ray methods. To validate these substrates for long-range order self-organization, the growth of Si and Ge quantum dots is finally achieved.
Keywords
X-ray diffraction; X-ray reflection; X-ray scattering; dislocation structure; elemental semiconductors; interface structure; long-range order; nanostructured materials; nanotechnology; self-assembly; semiconductor quantum dots; silicon; surface topography; transmission electron microscopy; wafer bonding; 1 nm; Ge; Ge quantum dots; Si; Si quantum dots; Si-Si; X-ray reflectivity; bonding interfacial plane; bonding thickness; buried Si/Si interface; cross-section observations; dislocation networks; grazing incidence X-ray diffraction; grazing incidence X-ray techniques; grazing incidence small angle X-ray scattering measurements; interfacial thickness; long-range order; long-range order self-organization; molecular hydrophobic bonding; nanopatterned silicon surfaces; nanopatterned surface; nanostructures; periodic strain field; plane view observations; scanning tunneling microscopy; structure; tilt angles; transmission electron microscopy; twist angles; two-dimensional self-organization; ultrathin silicon layers; wafer bonding; Capacitive sensors; Crystals; Goniometers; Nanopatterning; Nanostructures; Silicon; Transmission electron microscopy; Wafer bonding; X-ray diffraction; X-ray scattering;
fLanguage
English
Journal_Title
Quantum Electronics, IEEE Journal of
Publisher
ieee
ISSN
0018-9197
Type
jour
DOI
10.1109/JQE.2002.801003
Filename
1021016
Link To Document