Volatile species from conductive die attach adhesives

Author

Benson, Richard C. ; Phillips, Terry E. ; Dehaas, Newman

Author_Institution

Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA

Volume

12

Issue

4

fYear

1989

fDate

12/1/1989 12:00:00 AM

Firstpage

571

Lastpage

577

Abstract

Microelectronic conductive die attach adhesives have been investigated to determine the volatile species that evolve during curing and after postcure processing, such as preseal bakeout and burn-in. Gas chromatography/mass spectrometry was used to measure the volatile species. Three different cure schedules were used to determine the relationship between outgassing rate and cure. Thermal analysis techniques were used to measure the exotherm, glass transition temperature, and total mass loss for each cure schedule. Results are presented and discussed in detail

Keywords

materials testing; microassembling; packaging; polymers; reliability; IC packages; burn-in; conductive die attach adhesives; cure schedules; curing; exotherm; glass transition temperature; organic adhesives; outgassing rate; postcure processing; preseal bakeout; total mass loss; volatile species; Chemical processes; Electronic packaging thermal management; Impurities; Inorganic materials; Microassembly; Moisture; Organic chemicals; Plasma temperature; Pollution measurement; Surface contamination;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.49018

Filename

49018