Title :
Volatile species from conductive die attach adhesives
Author :
Benson, Richard C. ; Phillips, Terry E. ; Dehaas, Newman
Author_Institution :
Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
fDate :
12/1/1989 12:00:00 AM
Abstract :
Microelectronic conductive die attach adhesives have been investigated to determine the volatile species that evolve during curing and after postcure processing, such as preseal bakeout and burn-in. Gas chromatography/mass spectrometry was used to measure the volatile species. Three different cure schedules were used to determine the relationship between outgassing rate and cure. Thermal analysis techniques were used to measure the exotherm, glass transition temperature, and total mass loss for each cure schedule. Results are presented and discussed in detail
Keywords :
materials testing; microassembling; packaging; polymers; reliability; IC packages; burn-in; conductive die attach adhesives; cure schedules; curing; exotherm; glass transition temperature; organic adhesives; outgassing rate; postcure processing; preseal bakeout; total mass loss; volatile species; Chemical processes; Electronic packaging thermal management; Impurities; Inorganic materials; Microassembly; Moisture; Organic chemicals; Plasma temperature; Pollution measurement; Surface contamination;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
