DocumentCode :
792630
Title :
Si/SiGe n-MODFETs on thin SiGe virtual substrates prepared by means of He implantation
Author :
Herzog, H.-J. ; Hackbarth, T. ; Seiler, U. ; König, U. ; Luysberg, M. ; Holländer, B. ; Mantl, Siegfried
Author_Institution :
Res. & Technol., DaimlerChrysler AG, Ulm, Germany
Volume :
23
Issue :
8
fYear :
2002
Firstpage :
485
Lastpage :
487
Abstract :
Si/SiGe n-type modulation-doped field-effect transistors grown on a very thin strain-relieved Si/sub 0.69/Ge/sub 0.31/ buffer on top of a Si(100) substrate were fabricated and characterized. This novel type of virtual substrate has been created by means of a high dose He ion implantation localized beneath a 95-nm-thick pseudomorphic SiGe layer on Si followed by a strain relaxing annealing step at 850/spl deg/C. The layers were grown by molecular beam epitaxy. Electron mobilities of 1415 cm/sup 2//Vs and 5270 cm/sup 2//Vs were measured at room temperature and 77 K, respectively, at a sheet carrier density of about 3/spl times/10/sup 12//cm/sup 2/. The fabricated transistors with Pt-Schottky gates showed good dc characteristics with a drain current of 330 mA/mm and a transconductance of 200 mS/mm. Cutoff frequencies of f/sub t/=49 GHz and f/sub max/=95 GHz at 100 nm gate length were obtained which are quite close to the figures of merit of a control sample grown on a conventional, thick Si/sub 0.7/Ge/sub 0.3/ buffer.
Keywords :
Ge-Si alloys; S-parameters; carrier mobility; high electron mobility transistors; ion implantation; millimetre wave field effect transistors; molecular beam epitaxial growth; rapid thermal annealing; silicon; 293 to 298 K; 49 GHz; 77 K; 850 C; 95 GHz; DC characteristics; Pt-Schottky gates; S parameters; Si-SiGe; SiGe; electron mobilities; helium ion implantation; heterostructure; high dose implantation; molecular beam epitaxy; n-MODFET; pseudomorphic layer; rapid thermal annealing; sheet carrier density; strain relaxing annealing; thin strain-relieved buffer; thin virtual substrate; Annealing; Capacitive sensors; Epitaxial layers; FETs; Germanium silicon alloys; Ion implantation; Silicon germanium; Substrates; Temperature measurement;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2002.801336
Filename :
1021101
Link To Document :
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