DocumentCode :
792860
Title :
Integrating nanowires with substrates using directed assembly and nanoscale soldering
Author :
Ye, Hongke ; Gu, Zhiyong ; Yu, Thomas ; Gracias, David H.
Author_Institution :
Dept. of Chem. & Biomolecular Eng., Johns Hopkins Univ., Baltimore, MD, USA
Volume :
5
Issue :
1
fYear :
2006
Firstpage :
62
Lastpage :
66
Abstract :
This paper describes a new methodology for integrating nanowires with micropatterned substrates using directed assembly and nanoscale soldering. Nanowires containing ferromagnetic nickel segments were fabricated by electrodeposition in nanoporous membranes. The nanowires were released by dissolution of the membrane and subsequently aligned relative to micropatterned substrates using magnetic field-directed assembly. After assembly, the wires were permanently bonded to the substrates using solder reflow to form low-resistance electrical contacts. This is the first demonstration of the use of nanoscale solder reflow to form low-resistance electrical interconnects between nanowires and substrates, and we demonstrated the utility of the strategy by fabricating a nanowire-based functional analog integrator.
Keywords :
VLSI; electrical contacts; electrodeposition; ferromagnetic materials; nanoporous materials; nanotechnology; nanowires; soldering; substrates; electrical interconnects; electrodeposition; ferromagnetic nickel segments; functional analog integrator; integrating nanowires; low-resistance electrical contacts; magnetic assembly; magnetic field-directed assembly; micropatterned substrates; nanoelectronics; nanoporous membranes; nanoscale soldering; nanotechnology; very large scale integration; Assembly; Biomembranes; Bonding; Contacts; Magnetic fields; Nanoporous materials; Nanowires; Nickel; Soldering; Wires; Directed assembly; electrical contact; magnetic assembly; nanoelectronics; nanotechnology; semiconductor devices; solder reflow; very large scale integration (VLSI);
fLanguage :
English
Journal_Title :
Nanotechnology, IEEE Transactions on
Publisher :
ieee
ISSN :
1536-125X
Type :
jour
DOI :
10.1109/TNANO.2005.861399
Filename :
1576738
Link To Document :
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