Title :
Chirped fiber-Bragg grating as self-temperature referenced strain sensor in nonisothermal thermoset processing
Author :
Cusano, Andrea ; Capoluongo, Patrizio ; Cutolo, Antonello ; Giordano, Michele
Author_Institution :
Eng. Dept., Univ. of Sannio, Benevento, Italy
Abstract :
A partially embedded chirped fiber-Bragg grating (FBG) has been used to monitor the strain build up during nonisothermal curing of a model thermoset resin. The particular feature of the spectrum of a linearly chirped and strongly apodized FBG to encode position along the sensor has been used to simultaneously measure temperature and strain during the cure cycle of an epoxy-based polymer. In particular, the embedded part of the grating allows the monitoring of temperature and processing strain while the rest of the sensor is sensible to temperature variation only. A new self-temperature referenced sensor system has been successfully tested in an operative condition where usually thermomechanical loading are simultaneously active. The onset and progression of gelification, as well as the residual processing strain, have been experimentally measured.
Keywords :
Bragg gratings; compensation; condition monitoring; curing; fibre optic sensors; strain measurement; strain sensors; temperature measurement; cure monitoring; fiber optic sensors; gelification process; model thermoset resin; nonisothermal curing; nonisothermal thermoset processing; partially embedded chirped fiber-Bragg grating; residual processing strain; self-temperature referenced strain sensor; strain build up monitoring; strain measurement; temperature compensation; temperature measurement; temperature monitoring; thermal apparent strain; thermomechanical loading; Bragg gratings; Capacitive sensors; Chirp; Curing; Fiber gratings; Monitoring; Strain measurement; Temperature measurement; Temperature sensors; Thermal sensors; Chirped fiber-Bragg grating (FBG); cure monitoring; fiber-optic sensors; strain sensor; temperature compensation; thermal apparent strain;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2005.856546