• DocumentCode
    793651
  • Title

    Silicon carbide benefits and advantages for power electronics circuits and systems

  • Author

    Elasser, Ahmed ; Chow, T. Paul

  • Author_Institution
    Gen. Electr. Corporate Res. & Dev., Niskayuna, NY, USA
  • Volume
    90
  • Issue
    6
  • fYear
    2002
  • fDate
    6/1/2002 12:00:00 AM
  • Firstpage
    969
  • Lastpage
    986
  • Abstract
    Silicon offers multiple advantages to power circuit designers, but at the same time suffers from limitations that are inherent to silicon material properties, such as low bandgap energy, low thermal conductivity, and switching frequency limitations. Wide bandgap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), provide larger bandgaps, higher breakdown electric field, and higher thermal conductivity. Power semiconductor devices made with SiC and GaN are capable of higher blocking voltages, higher switching frequencies, and higher junction temperatures than silicon devices. SiC is by far the most advanced material and, hence, is the subject of attention from power electronics and systems designers. This paper looks at the benefits of using SiC in power electronics applications, reviews the current state of the art, and shows how SiC can be a strong and viable candidate for future power electronics and systems applications.
  • Keywords
    power convertors; power electronics; power semiconductor devices; silicon compounds; wide band gap semiconductors; SiC; bandgaps; blocking voltages; breakdown electric field; junction temperatures; power converters; power electronics circuits; power electronics systems; power semiconductor devices; switching frequencies; thermal conductivity; wide bandgap semiconductors; Circuits and systems; Gallium nitride; III-V semiconductor materials; Material properties; Photonic band gap; Power electronics; Silicon carbide; Switching frequency; Thermal conductivity; Wide band gap semiconductors;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2002.1021562
  • Filename
    1021562