A new multichip module using a copper polyimide multilayer substrate

Author

Sasaki, Shinichi ; Kon, Taichi ; Ohsaki, Takaaki ; Yasuda, Toyoshi

Author_Institution

NTT Appl. Electron. Lab., Tokyo, Japan

Volume

12

Issue

4

fYear

1989

fDate

12/1/1989 12:00:00 AM

Firstpage

658

Lastpage

662

Abstract

A new multichip module using a multilayer substrate with a polyimide dielectric and a fine pattern of copper conductors is presented. This substrate contains small copper columnar vias which reduce the thermal resistance of polyimide layers without causing a channel accommodation decrease, and thin-film resistors for terminated transmission. This module can densely mount high-speed LSI chips that produce twice as much heat as those in conventional modules. Furthermore, this module can transmit high-speed pulses at over 2 Gb/s

Keywords

large scale integration; modules; packaging; thin film resistors; 2 Gbit/s; Cu; Cu polyimide multilayer substrate; channel accommodation decrease; copper columnar vias; fine copper conductor pattern; high-speed LSI chips; high-speed pulses; multichip module; polyimide dielectric; terminated transmission; thermal resistance; thin-film resistors; Conductors; Copper; Dielectric substrates; Dielectric thin films; Large scale integration; Multichip modules; Nonhomogeneous media; Polyimides; Resistors; Thermal resistance;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.49030

Filename

49030