DocumentCode :
794270
Title :
Temperature dependence modeling for MOS VLSI circuit simulation
Author :
Wan, Chung-Ping ; Sheu, Bing J.
Author_Institution :
Inf. Sci. Inst., Univ of Southern California, Los Angeles, CA, USA
Volume :
8
Issue :
10
fYear :
1989
fDate :
10/1/1989 12:00:00 AM
Firstpage :
1065
Lastpage :
1073
Abstract :
An accurate and efficient temperature modeling methodology for the semiempirical BSIM (Berkeley short-channel IGFET model) has been developed for MOS VLSI circuit simulation. A sensitive model parameter subset which has large effects on transistor output characteristics is determined from the sensitivity analysis. Updating of model parameter values for this sensitive subset is performed prior to circuit simulation at each given temperature. For a 1.2 μm CMOS process, the sensitive subset for temperature effects consists of only eight out of the 67 BSIM parameters. Circuit simulation using this sensitive subset approach to predict temperature effects has shown good agreement with experimental data on transistor output characteristics, inverter transfer characteristics, and oscillation frequency of a 31-stage ring oscillator
Keywords :
MOS integrated circuits; VLSI; circuit analysis computing; semiconductor device models; sensitivity analysis; temperature; 1.2 micron; Berkeley short-channel IGFET model; CMOS process; MOS VLSI; circuit simulation; sensitive model parameter subset; sensitivity analysis; temperature dependence; temperature modeling methodology; transistor output characteristics; CMOS process; Circuit simulation; Frequency; Inverters; Ring oscillators; Semiconductor device modeling; Sensitivity analysis; Temperature dependence; Temperature sensors; Very large scale integration;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.39068
Filename :
39068
Link To Document :
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