Effect of temperature on electrical conduction of carbon-black-filled polyimide

Author

Gupta, Tapan K.

Author_Institution

Dept. of Electr. Eng., Tufts Univ., Medford, MA, USA

Volume

12

Issue

4

fYear

1989

fDate

12/1/1989 12:00:00 AM

Firstpage

696

Lastpage

700

Abstract

A study of the stability of two types of carbon resistive paste based on polyimide is reported. Experiments on electrical properties of these thick-film resistors at elevated temperatures are recorded, and the electrical conduction mechanism in thick-film resistors is demonstrated. The conduction mechanism follows closely the model proposed by V. Ambegoekar et al. (1971), while the curing mechanism agrees well with that suggested by N.F. Mott and E.A. Davis (1971). Some of the observed phenomena have been explained on the basis of disordered solids that have many carriers with low electron mobility. The apparently anomalous temperature coefficient of resistance versus temperature behavior finds an immediate explanation in the disordered-system model

Keywords

electrical conductivity of solids; filled polymers; thick film resistors; C resistive paste; anomalous temperature coefficient; carbon-black-filled polyimide; curing mechanism; disordered solids; disordered-system model; electrical conduction; low electron mobility carriers; thick-film resistors; Curing; Lattices; Manufacturing; Mechanical factors; Pigmentation; Polyimides; Resistors; Solids; Stability; Temperature dependence;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.49035

Filename

49035