DocumentCode
794974
Title
Nonlinear thermal behavior of a plastic leaded chip carrier package
Author
Di Barba, Paolo ; Savini, Antonio
Author_Institution
Dept. of Electr. Eng., Pavia Univ., Italy
Volume
12
Issue
4
fYear
1989
fDate
12/1/1989 12:00:00 AM
Firstpage
741
Lastpage
744
Abstract
A finite-element simulation of the steady-state thermal field in a freely suspended plastic package of the plastic leaded chip carrier type is presented. Numerical results are reported and compared with the corresponding experimental ones. The nonlinear dependence of thermal resistance on dissipated power is shown
Keywords
cooling; finite element analysis; packaging; thermal resistance; PLCC; dissipated power; finite-element simulation; nonlinear thermal behaviour; numerical results; plastic leaded chip carrier package; steady-state thermal field; thermal resistance; Circuits; Cooling; Heat transfer; Lead; Manufacturing; Plastic packaging; Prototypes; Steady-state; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.49041
Filename
49041
Link To Document