• DocumentCode
    795044
  • Title

    Patterned magnetic media from self-assembly template methods

  • Author

    Zhukov, A.A. ; Goncharov, A.V. ; de Groot, P.A.J. ; Bartlett, P.N. ; Ghanem, M.A. ; Küpfer, H. ; Pugh, R.J. ; Tomka, G.J.

  • Author_Institution
    Dept. of Phys. & Astron., Univ. of Southampton, UK
  • Volume
    150
  • Issue
    5
  • fYear
    2003
  • Firstpage
    257
  • Lastpage
    259
  • Abstract
    Using lyotropic liquid crystalline phases and self-assembly from colloidal suspensions of polystyrene latex spheres, well-ordered, nanostructured templates were prepared. The results of electrochemical deposition of magnetic metals and alloys in the voids of these templates are presented. This technique has enabled the creation of magnetic nanostructures with 3D-achitectures on length scales 4 nm-1 μm. Changes in coercive field, by more than an order of magnitude were found, dominated by the effects of domain wall pinning. Clear transverse magnetisation suggests a Bloch type of domain walls. The in-plane component of the magnetic field drives the magnetic hysteresis. The templated electrodeposition technique offers the potential of a low-cost preparation method for sub-micron patterned magnetic media.
  • Keywords
    coercive force; colloids; electrodeposits; lyotropic liquid crystals; magnetic hysteresis; magnetic thin films; nanostructured materials; pattern formation; polymers; self-assembly; voids (solid); 3D magnetic nanostructures; 4 nm to 1 micron; Bloch type domain walls; coercive field changes; colloidal suspensions; domain wall pinning; electrochemical deposition; electrodeposition; lyotropic liquid crystals; magnetic alloys; magnetic field in-plane component; magnetic films; magnetic hysteresis; magnetic metals; nanostructure length scales; nanostructured templates; patterned magnetic media; polystyrene latex spheres; self-assembly template methods; template voids; transverse magnetisation; well-ordered templates;
  • fLanguage
    English
  • Journal_Title
    Science, Measurement and Technology, IEE Proceedings -
  • Publisher
    iet
  • ISSN
    1350-2344
  • Type

    jour

  • DOI
    10.1049/ip-smt:20030880
  • Filename
    1233966