DocumentCode :
79660
Title :
Power Module and Cooling System Thermal Performance Evaluation for HEV Application
Author :
Puqi Ning ; Zhenxian Liang ; Wang, F.
Author_Institution :
Power Electron. & Electr. Machinery Group, Oak Ridge Nat. Lab., Oak Ridge, TN, USA
Volume :
2
Issue :
3
fYear :
2014
fDate :
Sept. 2014
Firstpage :
487
Lastpage :
495
Abstract :
To further reduce system costs and package volumes of hybrid electric vehicles, it is important to optimize the power module and associated cooling system. This paper reports the thermal performance evaluation and analysis of three commercial power modules and a proposed planar module with different cooling system. Results show that power electronics can be better merged with the mechanical environment. Experiments and simulations were conducted to help further optimization.
Keywords :
cooling; hybrid electric vehicles; modules; power electronics; HEV application; cooling system; hybrid electric vehicles; mechanical environment; planar module; power electronics; power module; thermal performance evaluation; Cooling; Insulated gate bipolar transistors; Multichip modules; Temperature measurement; Temperature sensors; Thermal resistance; Electric vehicles; semiconductor device packaging;
fLanguage :
English
Journal_Title :
Emerging and Selected Topics in Power Electronics, IEEE Journal of
Publisher :
ieee
ISSN :
2168-6777
Type :
jour
DOI :
10.1109/JESTPE.2014.2303143
Filename :
6727409
Link To Document :
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