Title :
Excitation of plate waves in thickness measurements of layers deposited on thin plates
Author :
Tsukahara, Yusuke ; Nakaso, Noritaka ; Kushibiki, Jun-ichi ; Chubachi, Noriyoshi
Author_Institution :
Toppan Printing Co. Ltd., Saitama, Japan
Abstract :
Layer thickness measurements with an acoustic micrometer using pseudo-Sezawa waves in which ultrasonic waves are obliquely applied to a layered surface of a specimen have been proposed. A case in which the plate thickness of the specimen is so thin that it cannot be regarded as a half space is studied. A number of modes of plate waves are then excited in addition to pseudo-Sezawa waves. The plate waves, giving rise to the appearance of extra dips in the power spectrum of reflected waves, cause difficulties in the measurements. To prevent the excitation of plate waves, it is proposed that a mask of a sound-insulating material with a slit aperture should be placed on the layered surface of the specimen. Experiments and theoretical calculations, using lead frames of LSI chips as typical test specimens with thin substrates, were performed to demonstrate the effectiveness of the present method in preventing the excitation of plate waves.<>
Keywords :
integrated circuit testing; large scale integration; micrometry; thickness measurement; ultrasonic measurement; LSI chips; acoustic micrometer; lead frames; plate waves; power spectrum; pseudo-Sezawa waves; slit aperture; sound-insulating material; thickness measurements; ultrasonic waves; Acoustic materials; Apertures; Large scale integration; Performance evaluation; Power measurement; Semiconductor device measurement; Surface acoustic waves; Surface waves; Testing; Thickness measurement;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on