Discussion with reply, of "Surface dielectric behavior of polymeric insulation under HV outdoor conditions" by R.S. Gorur and T. Orbeck

Author

Danikas, M.G.

Author_Institution

Segag AG, Malters, Switzerland

Volume

27

Issue

3

fYear

1992

fDate

6/1/1992 12:00:00 AM

Firstpage

675

Lastpage

676

Abstract

The commenter raises issues concerning the specific compositions of molding compounds not discussed in the original paper by R.S. Gorur and T. Orbeck (ibid., vol.26, no.5, p.1064-72, 1991). It is pointed out by Gorur and Orbeck that the questions raised by the commenter are based on detailed descriptions of materials given in some of the nine additional references listed in the discussion. Gorur and Orbeck state their belief that it is not possible or meaningful to readers to discuss these topics without prior knowledge of these references. They point out that their work was intended as a technical review of research and development work on surface dielectric behavior of polymeric insulation. It was focused on the dynamic nature of polymer surfaces and its effects on electrical behavior under HV stress.<>

Keywords

composite insulating materials; dielectric properties of solids; environmental degradation; filled polymers; high-voltage engineering; leakage currents; organic insulating materials; polymers; wetting; HV outdoor conditions; HV stress; dynamic nature; hydrophobicity; leakage current; molding compounds; polymer surfaces; polymeric insulation; specific compositions; surface dielectric behavior; Dielectrics and electrical insulation; Insulation life; Leakage current; Plastic insulation; Pollution; Polymers; Rubber; Silicon; Temperature;

fLanguage

English

Journal_Title

Electrical Insulation, IEEE Transactions on

Publisher

ieee

ISSN

0018-9367

Type

jour

DOI

10.1109/14.142733

Filename

142733