DocumentCode :
797364
Title :
Temperature and electric field characteristics of time-dependent dielectric breakdown for silicon dioxide and reoxidized-nitrided oxides
Author :
Lin, Chi-hung ; Cable, James ; Woo, Jason C S
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Volume :
42
Issue :
7
fYear :
1995
fDate :
7/1/1995 12:00:00 AM
Firstpage :
1329
Lastpage :
1332
Abstract :
TDDB characteristics of 150 Å reoxidized nitrided oxide (ONO) gate dielectrics were examined at temperatures from 77 K to 400 K. These ONO films were processed with different conditions of rapid thermal nitridation (RTN) and rapid thermal re-oxidation (RTO). Optimized ONO films show better Qbd performance while maintaining a similar temperature and electric field dependence compared to SiO2. The low temperature activation energy for ONO and SiO2 is found to be strongly temperature dependent, and the charge to breakdown, Qbd, is closely related to the electron trap generation/trapping rate rather than the amount of hole trapping for high field stress. To further verify the effect of hole trapping on TDDB, X-ray irradiation was applied to wafers at different process steps. The results clearly show that the amount of hole trapping does not correlate with the charge to breakdown
Keywords :
CMOS integrated circuits; MIS devices; X-ray effects; dielectric thin films; electric breakdown; electron traps; hole traps; nitridation; oxidation; rapid thermal processing; silicon compounds; 150 A; 77 to 400 K; CMOS gate dielectrics; ONO films; ONO gate dielectric; RTN; RTO; Si-SiO2; SiO2-Si3N4-SiO2; X-ray irradiation; charge to breakdown; electric field characteristics; electron trap generation; hole trapping; low temperature activation energy; rapid thermal nitridation; rapid thermal re-oxidation; reoxidized-nitrided oxides; temperature characteristics; time-dependent dielectric breakdown; trapping rate; Design for quality; Dielectric breakdown; Electric breakdown; Electron traps; Furnaces; Nitrogen; Rapid thermal processing; Silicon; Stress; Temperature dependence;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.391216
Filename :
391216
Link To Document :
بازگشت