DocumentCode :
797704
Title :
IR uncooled bolometers based on amorphous GexSi1-xOy on silicon micromachined structures
Author :
Iborra, Enrique ; Clement, Marta ; Herrero, Lucia Vergara ; Sangrador, Jesus
Author_Institution :
Departamento de Tecnologia Electronica, Univ. Politecnica de Madrid, Spain
Volume :
11
Issue :
4
fYear :
2002
fDate :
8/1/2002 12:00:00 AM
Firstpage :
322
Lastpage :
329
Abstract :
In this work, we present the fabrication of bulk micromachined microbolometers made of amorphous germanium-silicon-oxygen compounds (GexSi1-xOy) grown by reactive sputtering of a Ge0.85Si0.15 target. We describe the complete procedure for fabricating thermally isolated microbolometers consisting of GexSi1-xOy sensing films deposited on sputtered silicon dioxide membranes suspended over a silicon substrate. The electrical properties of the sensitive material are set by controlling the deposition parameters of the sputtering technique. Under optimum deposition conditions, GexSi1-xOy layers with moderate electrical resistivity and thermal coefficient at room temperature as high as -4.2% · K-1 can be obtained. Isolated structures measured at atmospheric pressure in air have a thermal conductance of 3 × 10-6 W · K-1 and a thermal capacitance of 6·10-9 W · s · K-1, yielding a response time of 1.8 ms. Bolometers with an IR responsivity of 380 V · W-1 and a NEDT of 3.85 K at 100 nA bias current are obtained. The use of sputtered films allows designing a fully low-temperature fabrication process, wholly compatible with silicon integrated circuit technologies.
Keywords :
Ge-Si alloys; amorphous semiconductors; bolometers; electrical resistivity; infrared detectors; micromachining; microsensors; sputter deposition; thermal conductivity; 1.8 ms; 100 nA; Ge0.85Si0.15; Ge0.85Si0.15 target; GexSi1-xOy-SiO2-Si; IR responsivity; IR uncooled bolometers; Si; Si micromachined structures; amorphous GexSi1-xOy; bias current; bulk micromachining; electrical properties; electrical resistivity; isolated structures; low-temperature fabrication process; optimum deposition conditions; reactive sputtering; response time; silicon integrated circuit technology compatibility; sputtered SiO2 membranes; sputtering deposition parameters; thermal capacitance; thermal coefficient; thermal conductance; thermally isolated microbolometers; Amorphous materials; Biomembranes; Bolometers; Electric resistance; Fabrication; Semiconductor films; Silicon compounds; Sputtering; Thermal conductivity; Thermal resistance;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2002.800926
Filename :
1022843
Link To Document :
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