DocumentCode :
797735
Title :
Wireless micromachined ceramic pressure sensor for high-temperature applications
Author :
Fonseca, Michael A. ; English, Jennifer M. ; Von Arx, Martin ; Allen, Mark G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
11
Issue :
4
fYear :
2002
fDate :
8/1/2002 12:00:00 AM
Firstpage :
337
Lastpage :
343
Abstract :
In high-temperature applications, such as pressure sensing in turbine engines and compressors, high-temperature materials and data retrieval methods are required. The microelectronics packaging infrastructure provides high-temperature ceramic materials, fabrication tools, and well-developed processing techniques that have the potential for applicability in high-temperature sensing. Based on this infrastructure, a completely passive ceramic pressure sensor that uses a wireless telemetry scheme has been developed. The passive nature of the telemetry removes the need for electronics, power supplies, or contacts to withstand the high-temperature environment. The sensor contains a passive LC resonator comprised of a movable diaphragm capacitor and a fixed inductor, thereby causing the sensor resonant frequency to be pressure-dependent. Data is retrieved with an external loop antenna. The sensor has been fabricated and characterized and was compared with an electromechanical model. It was operated up to 400°C in a pressure range from 0 to 7 Bar. The average sensitivity and accuracy of three typical sensors are: -141 kHz Bar-1 and 24 mbar, respectively.
Keywords :
capacitive sensors; ceramics; high-temperature techniques; hybrid integrated circuits; microsensors; pressure sensors; radiotelemetry; 0 to 7 bar; 400 C; LTCC fabrication technology; accuracy; average sensitivity; capacitive sensor; ceramic green tape; compressors; data retrieval methods; electromechanical model; external loop antenna; fixed inductor; high-temperature applications; high-temperature ceramic materials; low-temperature cofireable ceramic; microelectronics packaging infrastructure; movable diaphragm capacitor; passive LC resonator; passive ceramic pressure sensor; pressure sensing; screen printing; sensor resonant frequency pressure dependence; turbine engines; wireless micromachined ceramic pressure sensor; wireless telemetry scheme; Capacitive sensors; Ceramics; Compressors; Electromechanical sensors; Engines; Information retrieval; Sensor phenomena and characterization; Telemetry; Turbines; Wireless sensor networks;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2002.800939
Filename :
1022845
Link To Document :
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