• DocumentCode
    797845
  • Title

    Delay Modeling and Statistical Design of Pipelined Circuit Under Process Variation

  • Author

    Datta, Animesh ; Bhunia, Swarup ; Mukhopadhyay, Saibal ; Roy, Kaushik

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
  • Volume
    25
  • Issue
    11
  • fYear
    2006
  • Firstpage
    2427
  • Lastpage
    2436
  • Abstract
    Under inter-die and intra-die parameter variations, the delay of a pipelined circuit follows a statistical distribution. This paper presents analytical models to estimate yield for a pipelined design based on delay distributions of individual pipe stages. Using the proposed models, it is shown that a change in logic depth and an imbalance between stage yields can improve the design yield and the area of a pipeline a circuit. A novel statistical methodology is developed to enhance yield of a pipelined circuit under an area constraint. Based on the concept of area borrowing, the results show that incorporating a proper imbalance among stage areas in a four-stage pipeline improves design yield up to 15.4% for the same area (and reduces area up to 8.4% under a yield constraint) compared with a balanced design
  • Keywords
    integrated circuit design; integrated circuit modelling; statistical distributions; delay distribution; delay modeling; gate-level sizing; inter-die parameter variations; intra-die parameter variations; logic depth; pipelined circuit design; pipelined circuit yield; statistical delay variation; statistical distribution; yield enhancement; Analytical models; Delay effects; Delay estimation; Logic circuits; Logic design; Pipeline processing; Statistical analysis; Statistical distributions; Throughput; Yield estimation; Gate-level sizing; pipeline design; statistical delay variation; yield enhancement;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2006.873886
  • Filename
    1715427