Disk-shaped miniature heat pipe (DMHP) with radiating micro grooves for a TO can laser diode package

Author

Chien, Hsin-Tang ; Lee, Da-Sheng ; Ding, Pei-Pei ; Chiu, Shiu-Lin ; Chen, Ping-Hei

Author_Institution

Mech. Eng. Dept., Nat. Taiwan Univ., Taiwan

Volume

26

Issue

3

fYear

2003

Firstpage

569

Lastpage

574

Abstract

A mounting base integrated with disk-shaped miniature heat pipe (DMHP) is designed for laser diode TO can package in the present study. The heat spreading performance of the disk-shaped miniature heat pipe is also presented. The present mounting base is made of aluminum (6061 T6) other than the conventional TO can package with oxygen free copper. The mounting base shows different thermal resistance with different working fluid charge volume. By optimizing the working fluid charge volume, the thermal resistance of the present mounting base will become lower than the conventional base with an oxygen free copper disk for TO can package. Moreover, this novel design can be manufactured on a massive scale and the fabrication cost can thus be effectively reduced.

Keywords

aluminium; heat pipes; heat transfer; semiconductor device packaging; semiconductor lasers; thermal resistance; Al; LD TO can package; disk-shaped miniature heat pipe; heat spreader; laser diode package; micro groove heat pipe; mounting base; thermal resistance; working fluid charge volume; Copper; Costs; Diode lasers; Electronic packaging thermal management; Laser modes; Semiconductor device packaging; Semiconductor diodes; Semiconductor lasers; Temperature; Thermal resistance;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2003.817648

Filename

1234914