Title :
A 60-GHz multilayer parasitic microstrip array antenna on LTCC substrate for system-on-package
Author :
Seki, Tomohiro ; Honma, Naoki ; Nishikawa, Kenjiro ; Tsunekawa, Kouichi
Author_Institution :
NTT Network Innovation Labs., Nippon Telegraph & Telephone Corp., Kanagawa, Japan
fDate :
5/1/2005 12:00:00 AM
Abstract :
This letter describes a compact and high-gain multilayer parasitic microstrip array antenna (MPMAA). The design and performance of the proposed array antenna are presented. The antenna employs three layers with a 2×2 parasitic array on each layer. The developed prototype MPMAA employs a multilayer low-temperature co-fired ceramic (LTCC) substrate that is well suited to the assembly of MMIC chips. The fabricated MPMAA achieves a 7.17 dBi absolute gain at 60 GHz including the loss derived from the feeding parts and RF probe to measure its antenna performance. The spacing of the top layer of the parasitic array constructed by 2×2 elements has a free-space wavelength of 0.36 and the chip size is 10 mm2. The fabricated MPMAA achieves both compact and high directional gain and satisfies the requirements for a millimeter-wave system-on-package (SOP).
Keywords :
MMIC; microstrip antenna arrays; millimetre wave antenna arrays; system-on-chip; 60 GHz; 7.17 dB; MMIC chips; active integrated antenna; antenna performance; broadband mobile wireless access; low-temperature co-fired ceramic substrate; millimeter-wave frequency band; millimeter-wave system-on-package; multilayer parasitic microstrip array antenna; Antenna arrays; Assembly; Ceramics; MMICs; Microstrip antenna arrays; Microstrip antennas; Nonhomogeneous media; Performance gain; Prototypes; Radio frequency; Active integrated antenna; broadband mobile wireless access; low-temperature co-fired ceramic (LTCC) substrate; millimeter-wave frequency band; system-on-package (SOP);
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2005.847702