A high-Q quasi-planar filtering solution for 60-GHz applications

Author

Faure-Muret, N. ; Baillargeat, D. ; Verdeyme, S. ; GaliLre, J. ; Estebe, E. ; Ghesquiers, J.-P. ; Bernard, F.

Author_Institution

Inst. de Recherche en Commun. Opt. et Microondes, Limoges, France

Volume

15

Issue

5

fYear

2005

fDate

5/1/2005 12:00:00 AM

Firstpage

354

Lastpage

356

Abstract

A low insertion loss 2.2% bandwidth two-pole cavity filter was fabricated at 60 GHz by bonding metallized lids on each side of a 250-μm silicon substrate. The lids are made by dry etching of a 500-μm silicon substrate. The same process is used to etch via holes on the intermediate substrate. The position of these via holes fixes the external coupling and the coupling between the resonators. The measured unloaded quality factor is lied on the height of the cavity (1.05 mm) and is around 1100.

Keywords

Q-factor; cavity resonator filters; millimetre wave filters; 250 micron; 500 micron; 60 GHz; Si; dry etching; etch via holes; high-Q quasiplanar filtering solution; metallized lids; resonators; silicon substrate; two-pole cavity filter; unloaded quality factor; Bonding; Conductivity; Etching; Filtering; Frequency; Metallization; Q factor; Resonance; Resonator filters; Silicon; Dry etching; silicon substrate; two-pole cavity filter; via holes;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2005.847709

Filename

1427741