• DocumentCode
    799033
  • Title

    A novel time-domain method for synthesizing broadband macro-π models of differential via

  • Author

    Wu, Tzong-Lin ; Wang, Chen-Chao ; Kuo, Chun-Chih ; Hsieh, Jian-Sheng

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • Volume
    15
  • Issue
    5
  • fYear
    2005
  • fDate
    5/1/2005 12:00:00 AM
  • Firstpage
    378
  • Lastpage
    380
  • Abstract
    A novel time-domain approach is proposed to synthesize the broadband equivalent model of the differential via based on time-domain reflected (TDR)/transmitted waveforms either measured by TDR or simulated by finite-difference time-domain (FDTD) method. The step responses of the differential via are solved in terms of rational functions by the generalized pencil-of-matrix (GPOM) method. According to the step responses, the broadband macro-π model with each element represented by the optimum pole-residue forms is derived to model the differential via. The equivalent circuits of the macro-π model are synthesized by a systematic lumped-model extraction technique. The accuracy of this approach is demonstrated both in frequencyand time-domain.
  • Keywords
    differential equations; electromagnetic interference; equivalent circuits; finite difference time-domain analysis; microstrip discontinuities; printed circuits; SPICE model; broadband macro-π models; differential via; finite-difference time-domain method; generalized pencil-of-matrix method; high-speed interconnects; lumped-model extraction technique; optimum pole-residue forms; rational functions; signal integrity; time-domain reflected waveforms; Circuit simulation; Circuit synthesis; Electromagnetic interference; Equivalent circuits; Finite difference methods; Frequency; Integrated circuit interconnections; SPICE; Signal synthesis; Time domain analysis; Differential via; SPICE model; finite-difference time-domain (FDTD); high-speed interconnects; signal integrity; time-domain reflected (TDR);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2005.847725
  • Filename
    1427749