DocumentCode
799086
Title
Characterization of inductively coupled plasma using neural networks
Author
Kim, Byungwhan ; Park, Sungjin
Author_Institution
Dept. of Electron. Eng., Sejong Univ., Seoul, South Korea
Volume
30
Issue
2
fYear
2002
fDate
4/1/2002 12:00:00 AM
Firstpage
698
Lastpage
705
Abstract
Hemispherical inductively coupled plasma (HICP) in a chlorine (Cl 2) discharge is qualitatively characterized using neural networks. Plasma attributes collected with Langmuir probe from a HICP etch system include electron density, electron temperature, and plasma potential. Process factors that were varied in a 24 full-factorial experiment include RF power, bias power, pressure, and Cl 2 flow rate. Their experimental ranges are 700-900 W, 5-10 mtorr, 20-80 W, and 60-120 sccm, for source power, pressure, bias power, and Cl2 flow rate, respectively. To validate models, eight experiments were additionally conducted. Root mean-squared prediction errors of optimized models are 0.288 (1011/cm3), 0.301 (eV), and 0.520 (V), for electron density, electron temperature, and plasma potential, respectively. Model behaviors were in good agreement with experimental data and reports. For electron temperature and plasma potential, interaction effects between factors were observed to be highly complex, depending on the factors as well as on their levels. A close match was observed between the models of electron temperature and plasma potential
Keywords
Langmuir probes; chlorine; discharges (electric); neural nets; plasma density; plasma temperature; 0.301 eV; 0.520 V; 20 to 80 W; 5 to 10 mtorr; 700 to 900 W; Cl2; Cl2 discharge; Langmuir probe; RF power; electron density; electron temperature; hemispherical inductively coupled plasma; neural networks; optimized models; plasma potential; process factors; Electrons; Etching; Neural networks; Plasma applications; Plasma density; Plasma sources; Plasma temperature; Predictive models; Probes; Radio frequency;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/TPS.2002.1024272
Filename
1024272
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