Title :
SCR device fabricated with dummy-gate structure to improve turn-on speed for effective ESD protection in CMOS technology
Author :
Ker, Ming-Dou ; Hsu, Kuo-Chun
Author_Institution :
Nanoelectron. & Gigascale Syst. Lab., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fDate :
5/1/2005 12:00:00 AM
Abstract :
Turn-on speed is the main concern for an on-chip electrostatic discharge (ESD) protection device, especially in the nanoscale CMOS processes with ultrathin gate oxide. A novel dummy-gate-blocking silicon-controlled rectifier (SCR) device employing a substrate-triggered technique is proposed to improve the turn-on speed of an SCR device for using in an on-chip ESD protection circuit to effectively protect the much thinner gate oxide. The fabrication of the proposed SCR device with dummy-gate structure is fully process-compatible with general CMOS process, without using an extra mask layer or adding process steps. From the experimental results in a 0.25-μm CMOS process with a gate-oxide thickness of ∼50 Å, the switching voltage, turn-on speed, turn-on resistance, and charged-device-model ESD levels of the SCR device with dummy-gate structure have been greatly improved, as compared to the normal SCR with shallow trench isolation structure.
Keywords :
CMOS integrated circuits; electrostatic discharge; thyristors; 0.25 micron; 50 Å; CMOS technology; ESD protection; SCR; charged device model; dummy-gate structure; electrostatic discharge; nanoscale CMOS processes; shallow trench isolation; silicon-controlled rectifier; substrate-triggered technique; switching voltage; turn-on resistance; turn-on speed improvement; ultrathin gate oxide; CMOS process; CMOS technology; Circuits; Electrostatic discharge; Fabrication; Nanoscale devices; Protection; Rectifiers; Thyristors; Voltage; Charged device model (CDM); dummy gate; electrostatic discharge (ESD); silicon-controlled rectifier (SCR);
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2005.845112