DocumentCode
79979
Title
Analysis and Design of a Modular Multilevel Converter With Trapezoidal Modulation for Medium and High Voltage DC-DC Transformers
Author
Gowaid, I.A. ; Adam, Grain P. ; Ahmed, Shehab ; Holliday, Derrick ; Williams, Barry W.
Author_Institution
Dept. of Electron. & Electr. Eng., Univ. of Strathclyde, Glasgow, UK
Volume
30
Issue
10
fYear
2015
fDate
Oct. 2015
Firstpage
5439
Lastpage
5457
Abstract
Conventional dual-active bridge topologies provide galvanic isolation and soft-switching over a reasonable operating range without dedicated resonant circuits. However, scaling the two-level dual-active bridge to higher dc voltage levels is impeded by several challenges among which the high dv/dt stress on the coupling transformer insulation. Gating and thermal characteristics of series switch arrays add to the limitations. To avoid the use of standard bulky modular multilevel bridges, this paper analyzes an alternative modulation technique, where staircase approximated trapezoidal voltage waveforms are produced; thus, alleviating developed dv/dt stresses. Modular design is realized by the utilization of half-bridge chopper cells. This way the analyzed dc-dc transformer employs modular multilevel converters operated in a new mode with minimal common-mode arm currents, as well as reduced capacitor size, hence reduced cell footprint. Suitable switching patterns are developed and various design and operation aspects are studied. Soft-switching characteristics will be shown to be comparable to those of the two-level dual-active bridge. Experimental results from a scaled test rig validate the presented concept.
Keywords
DC-DC power convertors; modulation; alternative modulation technique; capacitor size reduction; cell footprint reduction; electrical stress; half-bridge chopper cell; high voltage DC-DC transformers; medium voltage DC-DC transformers; minimal common mode arm current; modular multilevel converter; staircase approximated trapezoidal voltage waveforms; trapezoidal modulation; Bridge circuits; Capacitance; Capacitors; Insulated gate bipolar transistors; Power transformer insulation; Stress; Switches; DC fault; Modular multilevel converter; dc fault; dc transformer; dc/dc power conversion; dual active bridge; dual-active bridge; modular multilevel converter (MMC);
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2014.2377719
Filename
6977967
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