Power electronic interconnects: skin- and Proximity-Effect-based frequency Selective-Multipath propagation

Structural electromagnetic effects, attributed to the packaging and construction of power electronic converters, are often seen as detrimental and it is attempted to eliminate these "parasitics." This paper explores the utilization of some of these structural electromagnetic effects to achieve higher levels of functional integration in modules by obtaining low-pass filtering for various applications by controlling the material and geometry of selected interconnecting structures. Multipath propagation with frequency selective attenuation is one of the promising new technologies presented. Modeling and experimental results are given for a number of different cases showing promise for future integration into power electronic products as currently discussed in the literature. The conclusion reached from the research is that phenomena like the skin and proximity effect that are often considered as detrimental and to be avoided or minimized, can indeed be controlled and used to enhance the operation of power electronic systems.